Packaging & Laser Marking expert for photonics and microwave applications
Our Products
Photonics Packaging
- Multilayer HTCC feedthrough with high density
- Kovar Frame
- Ni+Au plate finish
- Multiple heatsink choices
- Hermeticity: ≤ 1 × 10^{-9} (Pa ⋅ m)/sec
- Resistance: ≥ 1 × 10^9 Ω (100V DC)
Photonics Sensor Packaging
- Customizable: feedthrough (HTCC or glass), shape and size of structure, number of pins, etc.
- Gold plate finish available
- Hermeticity: ≤ 1 × 10^{-9} (Pa ⋅ m)/sec
- Heatsink: TU1, WCu, with thermal conductivity up to 300 W/(m⋅K)
RF Power Module Packaging
- The RF feedthrough of the packaging uses HTCC ceramic technology, which meets C-band requirements and can support specifications up to the X-band
- Heatsink: WCu, MoCu, CPC, and CMC with thermal conductivity up to 260 W/(m⋅K)
- Lead materials: Kovar, TU1
CQFN Packaging
- Ceramic Quad-Flat No-leads(CQFN), capable of transmitting DC to 40 GHz signals.
- Compact size, lightweight, and excellent high-frequency performance
- Suitable for low-power chip packaging
Laser Marking Machine (I)
- Model: XC-10A/10B/10G
- Gold-plated components, non-destructive
- Wavelength: 532 nm
- Power: 10W
- Beam Quality: <=1.2
- Marking Speed: 8000 mm/s
Laser Marking Machine (II)
- Model: XC-30TC
- Specifically for alumina materials
- wavelength: 1064 nm
- Power: 30W
- Beam Quality: <=1.5
- Marking Speed: 8000 mm/s
Laser Spot Welding Machine
- Welding silver-copper and gold-tin pre-positioned weld tabs
- Low porosity rate
- Built-in vision for precise positioning, making the process fast and efficient.